Difficulty
Very difficult
Steps
5
Time Required
45 minutes - 1 hour
Sections
1
- Power Integrated Circuit (IC)
- 5 steps
Flags
3
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BackSamsung Galaxy S10+
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Introduction
Video Overview
Step 1
Power Integrated Circuit (IC)
- Check the state of the motherboard. Both the power integrated circuit (IC) and camera IC have been soldered before.
- Install the motherboard to test it. Connect the display and the power cable. The motherboard shows a current leakage of 52 mA.
- Press the power button. Here, the reading has not changed. Therefore, the main power supply line of the motherboard may be faulty.
- Measure several power supply lines of the motherboard using the multimeter’s diode mode. Inductor L5039 is shorted to the ground.
Check the state of the motherboard. Both the power integrated circuit (IC) and camera IC have been soldered before.
Install the motherboard to test it. Connect the display and the power cable. The motherboard shows a current leakage of 52 mA.
Press the power button. Here, the reading has not changed. Therefore, the main power supply line of the motherboard may be faulty.
Measure several power supply lines of the motherboard using the multimeter’s diode mode. Inductor L5039 is shorted to the ground.
1024
Step 2
- Open the schematic. It shows that L5039 is directly connected both to the main power supply line VBAT, and to the power IC U8031.
Open the schematic. It shows that L5039 is directly connected both to the main power supply line VBAT, and to the power IC U8031.
Step 3
- Since power IC U8031 has been soldered previously, we need to verify if it is faulty as a result.
- Attach the motherboard to the holder, applying some paste flux to the power IC.
- Heat with a hot air gun set at 340°C and airflow 3 to remove the IC.
Since power IC U8031 has been soldered previously, we need to verify if it is faulty as a result.
Attach the motherboard to the holder, applying some paste flux to the power IC.
Heat with a hot air gun set at 340°C and airflow 3 to remove the IC.
Step 4
- Clean the bonding pad with solder wick.
- Measure the inductor L5039 using the multimeter’s diode mode.
- Here, the diode value is 289, which is normal. Therefore, we can conclude that the power IC fault has resulted in the short circuit of the main power supply line.
- Clean the bonding pad with PCB cleaner and apply some paste flux.
Clean the bonding pad with solder wick.
Measure the inductor L5039 using the multimeter’s diode mode.
Here, the diode value is 289, which is normal. Therefore, we can conclude that the power IC fault has resulted in the short circuit of the main power supply line.
Clean the bonding pad with PCB cleaner and apply some paste flux.
Step 5
- Align the new IC. Solder it with a hot air gun set to 340°C and airflow 2. Once the motherboard has cooled, connect the power cable.
- Trigger the boot-up with tweezers. The boot current returns to normal.
- Install the motherboard. The phone turns on normally. The fault has been cleared.
Align the new IC. Solder it with a hot air gun set to 340°C and airflow 2. Once the motherboard has cooled, connect the power cable.
Trigger the boot-up with tweezers. The boot current returns to normal.
Install the motherboard. The phone turns on normally. The fault has been cleared.
To reassemble your device, follow these instructions in reverse order.
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REWA
Member since: 11/24/2020
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fazz_up - Nov 21, 2021
Reply
sir. in step 4. i remove IC U8031 and Clean the bonding pad with Solder Wick.but when i Measure the inductor L5039 with diode mode of the multimeter. The diode value is shorted to the ground. How i fix it? thank i’m from Thailand